typical connection half-bridge driver features ? floating channel designed for bootstrap operation fully operational to +600v tolerant to negative transient voltage dv/dt immune ? gate drive supply range from 10 to 20v ? undervoltage lockout for both channels ? 3.3v, 5v and 15v input logic compatible ? cross-conduction prevention logic ? matched propagation delay for both channels ? outputs in phase with inputs ? logic and power ground +/- 5v offset. ? internal 540ns dead-time ? lower di/dt gate driver for better noise immunity data sheet no. pd60209_b IR2308 ( s ) www.irf.com 1 (refer to lead assignments for correct pin configuration). this/these diagram(s) show electrical connections only. please refer to our application notes and designtips for proper circuit board layout. description the IR2308(s) are high voltage, high speed power mosfet and igbt drivers with depen dent high and low side referenced output channels. proprietary hvic and latch immune cmos technologies enable rug- gedized monolithic construction. the logic input is compatible with standard cmos or lsttl output, down to 3.3v logic. the output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. the floating channel can be used to drive an n-channel power mosfet or igbt in the high side configuration which operates up to 600 volts. part input logic cross- conduction prevention logic dead-time ground pins 2106 com 21064 hin/lin no none vss/com 2108 internal 540ns com 21084 hin/lin yes programmable 0.54~5 s vss/com 2109 internal 540ns com 21094 in/sd yes programmable 0.54~5 s vss/com 2106//2108//2109/2304/2308 feature comparison 2304 hin/lin yes internal 100ns com 2308 yes hin/lin internal 540ns com v cc v b v s ho lo com hin lin lin hin up to 600v to load v cc packages 8-lead soic 8-lead pdip
2 www.irf.com IR2308 (s) symbol definition min. max. units v b high side floating absolute voltage -0.3 625 v s high side floating supply offset voltage v b - 25 v b + 0.3 v ho high side floating output voltage v s - 0.3 v b + 0.3 v cc low side and logic fixed supply voltage -0.3 25 v lo low side output voltage -0.3 v cc + 0.3 v in logic input voltage (hin & lin ) v ss - 0.3 v cc + 0.3 dv s /dt allowable offset supply voltage transient ? 50 v/ns p d package power dissipation @ t a +25 c (8 lead pdip) ? 1.0 (8 lead soic) ? 0.625 rth ja thermal resistance, junction to ambient (8 l ead pdip) ? 125 (8 lead soic) ? 200 t j junction temperature ? 150 t s storage temperature -50 150 t l lead temperature (soldering, 10 seconds) ? 300 absolute maximum ratings absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. all voltage param- eters are absolute voltages referenced to com. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. note 1: logic operational for v s of -5 to +600v. logic state held for v s of -5v to -v bs . (please refer to the design tip dt97-3 for more details). v c c/w w recommended operating conditions the input/output logic timing diagram is shown in figure 1. for proper operation the device should be used within the recommended conditions. the v s and v ss offset rating are tested with all supplies biased at 15v differential. vb high side floating supply absolute voltage v s + 10 v s + 20 v s high side floating supply offset voltage note 1 600 v ho high side floating output voltage v s v b v cc low side and logic fixed supply voltage 10 20 v lo low side output voltage 0 v cc v in logic input voltage com v cc t a ambient temperature -40 125 v symbol definition min. max. units c
www.irf.com 3 IR2308 (s) static electrical characteristics v bias (v cc , v bs ) = 15v, v ss = com, dt= v ss and t a = 25 c unless otherwise specified. the v il , v ih and i in parameters are referenced to v ss /com and are applicable to the respective input leads: hin and lin. the v o , i o and ron parameters are referenced to com and are applicable to the respective output leads: ho and lo. symbol definition min. typ. max. units test conditions v ih logic ?1? input voltage for hin & lin 2.9 ? ? v cc = 10v to 20v v il logic ?0? input voltage for hin & lin ? ? 0.8 v cc = 10v to 20v v oh high level output voltage, v bias - v o ? 0.8 1.4 i o = 20 ma v ol low level output voltage, v o ? 0.3 0.6 i o = 20 ma i lk offset supply leakage current ? ? 50 v b = v s = 600v i qbs quiescent v bs supply current 20 60 150 v in = 0v or 5v i qcc quiescent v cc supply current 0.4 1.0 1.6 ma v in = 0v or 5v i in+ logic ?1? input bias current ? 5 20 hin = 5v, lin = 5v i in- logic ?0? input bias current ? 1 2 hin = 0v, lin = 0v v ccuv+ v cc and v bs supply undervoltage positive going 8.0 8.9 10 v bsuv+ threshold v ccuv- v cc and v bs supply undervoltage negative going 7.4 8.2 9.0 v bsuv- threshold v ccuvh hysteresis 0.3 0.7 ? v bsuvh i o+ output high short circuit pulsed current 97 200 ? v o = 0v, pw 10 s i o- output low short circuit pulsed current 250 350 ? v o = 15v, pw 10 s v a a v ma dynamic electrical characteristics v bias (v cc , v bs ) = 15v, v ss = com, c l = 1000 pf, t a = 25 c, dt = vss unless otherwise specified. symbol definition min. typ. max. units test conditions t on turn-on propagation delay ? 220 300 v s = 0v t off turn-off propagation delay ? 200 280 v s = 0v or 600v mt delay matching | t on - t off | ?0 46 t r turn-on rise time ? 150 220 v s = 0v t f turn-off fall time ? 50 80 v s = 0v dt deadtime: lo turn-off to ho turn-on(dt lo-ho) & 400 540 680 ho turn-off to lo turn-on (dt ho-lo) mdt deadtime matching = | dt lo-ho - dt ho-lo | ?0 60 nsec
4 www.irf.com IR2308 (s) functional block diagram IR2308 lin uv detect delay com lo vcc hin dt vss vs ho vb pulse filter hv level shifter r r s q uv detect deadtime & shoot-through prevention pulse generator vss/com level shift vss/com level shift
www.irf.com 5 IR2308 (s) lead definitions symbol description hin logic input for high side gate driver output (ho), in phase lin logic input for low side gate driver output (lo), in phase v b high side floating supply ho high side gate driver output v s high side floating supply return v cc low side and logic fixed supply lo low side gate driver output com low side return lead assignments 8 lead pdip 8 lead soic IR2308 IR2308s 1 2 3 4 8 7 6 5 v cc hin lin com v b ho v s lo 1 2 3 4 8 7 6 5 v cc hin lin com v b ho v s lo
6 www.irf.com IR2308 (s) figure 1. input/output timing diagram figure 2. switching time waveform definitions figure 3. deadtime waveform definitions ho lo hin lin lin hin 50% 50% t r t on t f t off ho lo 90% 90% 10% 10% hin lin ho 90% 10% lo 90% 10% dt lo-ho dt lo-ho mdt= - dt ho-lo dt ho-lo 50 % 50 % ir world headquarters: 233 kansas street, el segundo, california 90245 tel: (310) 252-7105 data and specifications subject to change without notice. 3/19/2003
www.irf.com 7 IR2308 (s) 01-6014 01-3003 01 (ms-001ab) 8-lead pdip 01-6027 01-0021 11 (ms-012aa) 8-lead soic 87 5 65 d b e a e 6x h 0.25 [.010] a 6 4 3 12 4. outline conforms to jedec outline ms-012aa. notes: 1. dimensioning & toleranc ing per asme y14.5m-1994. 2. controlling dimension: millimeter 3. dimensions are shown in millimeters [inches]. 7 k x 45 8x l 8x c y footprint 8x 0.72 [.028] 6.46 [.255] 3x 1.27 [.050] 8x 1.78 [.070] 5 dimension does not include mold protrusions. 6 dimension does not include mold protrusions. mold protrusions no t to exc eed 0.25 [.010]. 7 dimension is the length of lead for soldering to a substrate. mold protrusions no t to exc eed 0.15 [.006]. 0.25 [.010] cab e1 a a1 8x b c 0.10 [.004] e1 d e y b a a1 h k l .189 .1497 0 .013 .050 basic .0532 .0040 .2284 .0099 .016 .1968 .1574 8 .020 .0688 .0098 .2440 .0196 .050 4.80 3.80 0.33 1.35 0.10 5.80 0.25 0.40 0 1.27 basic 5.00 4.00 0.51 1.75 0.25 6.20 0.50 1.27 min max millimeters in c h e s min max dim 8 e c .0075 .0098 0.19 0.25 .025 basic 0.635 basic case outlines http://www.irf.com/ data and specifications subject to change without notice. 10/20/2003
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